岗位职责
硕士学历2年以上半导体行业直接研发或生产经验，有志于长期投身于并开拓第三代半导体产业。
有国内第三代（宽禁带）或硅基功率器件制造领先公司工艺开发经验为佳，兼有8吋或12吋硅基开发或生产经验尤佳。
经验专注工艺（扩散、注入、退火、湿法清洗、薄膜 [CVD，PVD，ALD，蒸镀等]、干法刻蚀、光刻、背面减薄等）的某一个领域。
思路逻辑清晰，表达沟通能力较强，工作态度积极，讲究团队合作精神。
Qualifications and Requirements
Master degree with at least 2 years hands-on experience in semiconductor module R&D or manufacturing. Determined in long-term commitment to WBG semiconductor industry. Module development experience at tier-1 domestic WBG device or silicon power device manufacturing companies is the best, and big plus with the development and manufacturing experience in 200 or 300 silicon. Worked one specific module (diffusion, implantation, annealing, wet cleaning, thin film [CVD, PVD, ALD, evaporation etc.], dry etching, lithography and backside grinding. Good in logic reasoning and communication skills, proactive attitude, and team-work spirits.
申请方式
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